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深圳supfire为大家讲解下CREE LED芯片详细特点和如何辨别真伪

Q:Cree公司生产红光LED芯片吗?

A :Cree公司一直以来都没有生产红光LED芯片,只有蓝光、绿光和紫外光LED芯片。
 

Q:Cree的芯片都是碳化硅(SiC)材料为衬底的吗?
A:目前Cree公司的小功率LED芯片都是采用碳化硅(SiC)材料为衬底的,而EZBright系列LED芯片则采用Si衬底结构。Cree公司是世界上少有采用碳化硅(SiC)材料为衬底生产蓝光、绿光和紫外光LED芯片的公司。

 

Q:Cree有没有双电极结构的芯片?
A: Cree公司有推出采用碳化硅(SiC)材料为衬底的双电极结构芯片(ETC系列),型号有TR260、TR2432、TR2436等,以绝缘胶固晶为主,详情请参考Cree的产品规格书。


Q:Cree的芯片抗静电能力(ESD)如何?
A:Cree公司的所有采用碳化硅材料为衬底的LED系列芯片的抗静电能力都大于1000V(HBM),并且是百分之百测试。


Q: LED芯片静电击穿现象能够通过低倍显微镜观察到吗?

A:通常比较严重的静电击穿可以通过低倍显微镜观察到在芯片表面有黑色小孔。

而轻微的静电击穿则需要通过高倍显微镜或SEM才可以确定


Q:Cree公司的LED芯片在固晶时对银浆量有何要求?银浆过多或过少会产生什么样的结果?
A:Cree公司建议固晶时银浆量以芯片高度的1/3处为宜,最多不得超过1/2芯片高度,且芯片四周均有银浆包围。银浆过多,会遮挡芯片侧面出光,导致成品亮度降低,若银浆溢出到芯片表面还可能引起短路现象,甚至死灯。银浆过少,可能会导致接触不良,成品灯VF值升高或死灯等现象,另外银浆变质也可能导致上述问题的出现。

 

Q:Cree公司的LED芯片亮度通常用mw表示,请问mw和mcd之间如何换算?
A:Cree芯片的亮度一般用辐射功率RF(Radiant Flux)表示,单位是mw。它表示一个光源单位时间里发出的光能量,与客户的测量设备系统相关。而坎德拉(cd)是指单位立体角内的光通量,和封装的形状(透镜形状)有着很大的关系。两者的定义和测量方法都不相同, 因此mw和mcd之间无法换算。


Q:为何20mA分选的芯片,在5mA的电流下使用会出现亮度和颜色不均现象?
A:造成这种现象有以下几种原因:
1、 LED芯片的亮度和波长均会随电流的变化而变化,且变化是非线性的;对于绿光而言,其波长漂移幅度比蓝光的更大。
2、 LED芯片是在20mA恒流条件下分选的,若在恒压源下并联工作时,由于每个芯片的VF值不同引起电流分配不均,导致波长和亮度出现较大差异。
关于亮度、波长和电流关系的变化曲线请参考Cree的产品规格书。


Q:芯片中心光轴与支架几何中心没有对准会产生什么影响?
A:这种情况下,对成品而言会出现光强不一致,辐射功率降低,发光不对称等现象。

 

Q:金球偏离焊盘,会对产品造成什么影响?
A:金球偏出焊盘有可能会导致VF值升高及漏电产生,特别是双电极芯片的负电极端,焊线要求更加严格


Q:支架杯内壁被污染,对产品有何影响?
A:若支架内壁有污染物,将会影响成品亮度,严重会影响固晶质量,出现其他异常问题,因此固晶前和固晶后务必保证支架内壁的清洁。

led强光手电筒

 

Q: Cree produced red LED chip it?
A: Cree has been no production of red LED chips, only blue light, green and UV LED chip.
 
Q: Cree chip silicon carbide (SiC) substrate material is it?
A: the Cree small power LED chip and are based on silicon carbide (SiC) material as the substrate, while the the EZBright series LED chip Si substrate structure. The Cree is rare in the world of silicon carbide (SiC) materials for substrate production Blu-ray, green and ultraviolet LED chip companies.
 
Q: Cree dual-electrode structure chip?
A: Cree company introduced its silicon carbide (SiC) material as the substrate electrode structure chip (ETC series), Model TR260, TR2432, TR2436, mainly plastic insulation solid crystal, please refer to Cree's product specifications book.
 
Q: How the Cree chip antistatic capability (ESD)?
A: Cree company's silicon carbide substrate LED chip series antistatic ability are greater than 1000V (HBM), and 100% testing.
 
Q: LED chip electrostatic breakdown phenomenon through low magnification microscope to do?
A: usually more serious electrostatic breakdown can be observed through a low-magnification microscope to the apertures on the chip surface with black.
Slight electrostatic breakdown through a high power microscope or SEM can determine
 
Q: Cree company's LED chip solid crystal silver paste amount requirements? Silver is too much or too little will produce what kind of results?
A: Cree recommended amount of solid crystal when Silver chip 1/3 of the height is appropriate, shall not exceed a maximum of 1/2 chip height, and the chip four weeks have Silver surrounded. Silver excessive, obscures the chip side of the light, resulting in the finished decrease in brightness, may also cause a short circuit if the the silver paste overflow to the surface of the chip, and even dead lights. The silver paste is too small, it may cause poor contact, the VF value of the finished lamp elevated or dead lights and other phenomena, another silver paste deterioration may also result in the aforesaid problem.
 
Q: Cree Company brightness of the LED chip is usually expressed in mw, may I ask how do you convert between mw and mcd?
A: Cree chip brightness generally radiated power RF (Radiant Flux) said that the unit is mw. It represents the energy of the light emitted in a light source unit of time, associated with the customer's measuring equipment system. Candela (cd) is the luminous flux unit solid angle, and shape of the package (lens shape) have a great relationship. Both the definition and measurement methods are not the same, and therefore can not be translated between mw and mcd.
 
Q: Why 20mA sorting chips, 5mA current inequality of brightness and color?
A: This phenomenon several reasons:
1, the brightness of the LED chip and the wavelength will change with the current change, and the change is nonlinear; For green purposes, its wavelength shift magnitude greater than that of blue.
2, LED chip 20mA constant current conditions under separation, under constant voltage source in parallel work, caused by the uneven distribution of current VF value of each chip, wavelength and brightness appear quite different.
Curve Cree's product specifications please refer to changes in brightness, wavelength and current relationship.
 
Q: geometric center of the center of the chip optical axis bracket is not aligned with what impact?
A: In this case, the terms of the finished product appears light intensity is inconsistent, the radiation power is reduced, the light emitting asymmetric phenomenon.
 
Q: golden goal off the pad, what impact will the product?
A: gold ball misses pad may cause elevated VF value and the drain generated double electrode, a negative electrode terminal of the chip, bonding wires more stringent requirements
 
Q: the inner wall of the stent Cup pollution, and the impact of the products?
A: If the the bracket inner wall contaminants will affect the finished product brightness will seriously affect the quality of the solid crystal, other unusual problems, so sure and solid crystal solid crystal before stent wall clean.
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点击次数:  更新时间:2012-11-16 11:47:07  【打印此页】  【关闭